Mechanic Paste Flux 10CC Tin Soldering XG-Z40 Sn63/Pb37 25-45um with Syringe for Mobile Phone SMD PCB Repair Soldering Paste

The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is a mixture of high-quality alloyed powder and resinic pasty flux; it avoids generating the pale yellow residue, so you are easy to clean the board.

·Soldering paste for cell phone PCB and SMD etc. ·Help to repair the circuit boards and protect the electronic components ·A necessary material for repairing the mobile phone mainboard ·Flux Solder Paste - no clean soldering

MECHANIC BGA Solder Flux Paste Soldering Tin Cream

Specification: Material: Tin+Solder paste Color: As shown in the picture Size: Approx. 1.30 x 1.30 x 1.14inch / 3.3 x 3.2 x 2.9cm Type: XG-Z40 Alloy: Sn63/Pb37 Microns: 25-45um

Ships from our Christchurch Warehouse

Ships from our Christchurch Warehouse

All Items are sent Tracked.

All orders usually arrive within 3-5 working days but may be subject to longer depending on item size and courier speed.

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