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Details: Passive 1U rackmount CPU cooler from TGC for Intel LGA 775/1155/1366/2011 processors. Constructed from copper for optimal heat transfer. This passive heat sink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans. Specifications: Application: 1U Server chassis Radiating method: Passive Material: Full Copper Size: 22 x 88 x 88mm Centre area: 45 x 45 x 2.5mm Fin number: 42 pieces Fin height: 20mm Weight: 435g \r\nImport charges may apply to your purchase. Find out whether these apply here:
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