The Koch-Chemie Micro Cut Pad is made from high-quality specialised sponge designed to remove fine scratches, holograms, and polishing marks in collaboration with Koch-Chemie M3 Micro Cut Compound. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.

Compression hardness: 10 Abrasiveness: 5

Koch Chemie 2-step polishing system To achieve an ideal polishing result, it is not enough just to use an excellent polishing paste. Besides the polisher and expertise in application, the quality of a polishing pad is just as important. Koch Chemie has a two-step system, as opposed to the usual three-step system used by competitors. This allows for significant time savings.

Step 1: H9.01 or F6.01

Step 2: M3.02 or P3.01

Step 3: Optional gloss polish or coating -> if step 3 then do not use P3.01 as it already contains wax.

Remove swirls & marring Swirls are scratches in the paintwork that look like circles/circles. Marring is the name for scratches created during car claying with a clay bar or cleaning clay. These surface scratches are not deep in the paint, so you can easily remove this paint damage by polishing with this purple foam polishing pad.

REDLINE PERFORMANCE - Item Listed is " Compatible for use with " item Title and or Advert Make Model description if stated . Located Mount Roskill - Auckland Auckland Shipping Costs Does NOT include Waiheke Island