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Features:

• Double-sided uniform trimming, utility model patented technology
• The blade is from thin to thick, and the force is more uniform
• It is suitable for removing glue from the screen and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc
• Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield
• Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm

Package Includes:

• 2 x 1Uul Hand Finish Blades for Phone Screen Debonding/Removal Ic Model E

DELIVERY TIMEFRAME: 7-14 WORKING DAYS (Allow extra 5-7 Working days for RURAL DELIVERIES) 99% Packages Guaranteed Delivering on Time FULL TRACKING COURIER DISPATCH LOCATION: CHINA GST, IMPORT DUTY INCLUDED**DUTY&GST: CHECK HERE:https://bit.ly/2Y7IRJT SHIPPING POLICY: https://bit.ly/37zTmJc GOSLASH SATISFACTION GUARANTEE: Failed to receive this item after 30 days of purchase date or not satisfied. We will either issue you a refund or resend a new item. GUARANTEED!!